PCB Capability
PCBONLINE has been specialized in advanced PCB since 1999. Over the past years of continuous efforts, PCBONLINE constantly updates our own facility and equipment, improves our technologies, and provides customers with the highest product quality.
So far, our products apply to all walks of life, such as military, aerospace, medical, power, 5G communications, and other fields. PCBONLINE has a strong production capacity in rigid PCB, flex PCB, rigid-flex PCB, aluminum PCB, thick-copper PCB, MPCB, ceramic PCB, high-frequency PCB, etc. Below is our production capacity.
1.PCBONLINE PCB Delivery Time download
| Material |
(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180):
ShengYi, ITEQ, KB, TUC,Ventec,Isola,Doosan High Speed FR4, Ceramics & Telflon, Rogers | |
| Layer count | 1~24 | |
| HDI Stack up | 1+N+1，2+N+2，3+N+3(with copper filling) | |
| Final board thickness | 0.15-3.2mm | |
| Aspect Ratio |
Laser via PTH |
3：4 10：1 |
| Copper thickness | 1/3~6oz | |
| Impedance Control |
Single Ended Differential |
+/- 10% +/- 10% |
| Line/Space |
Inner Layer External Layer |
2.5/2.5mil 2.5/2.5mil |
| Min Drill Bit size | 8mil | |
| Hole size tolerance |
PTH NPTH |
+/-3mil +/-2mil |
| Hole Position Tolerance | +/-2mil | |
| Profile Tolerance |
Puching Routing |
+/-3mil +/-4mil |
| Soldermask |
Line to PAD Registration |
4mil +/-2mil |
| Warpage | 0.5% | |
| Surface Finish |
HASL(LF HASL) ENIG OSP Immersion Tin Immersion Silver Hard Gold Plating Peelable Mask Carbon ink |
SMD 40-2000u", GND 30-800u" Au 1-5u", Ni 80-200u" 0.8-1.2um 0.15-0.45um Au 1-50u", Ni 80-200u" 5mil 0.3mil |
| Remarks | Peelable Mask | 5mil |
| Carbon ink | 0.3mil | |
| Mixed Surface Finishes | OSP+ENIG, OSP+HASL | |
| Heavy Copper | External layers up to 12oz | |
| Long PCB | max 1.5m for DS | |
| (High R) Carbon | Available | |
| Gold finger | Available | |
| Jump V-Cut | Available | |
| PCB Edge plating | Available | |
| Countersink & Counterbore | Available | |
| Sequential lamination | Available | |
| Step Routing | Available | |
2.Flex-rigid capability download
| Material | Polyimide: Taiflex, Shengyi | |
| Layer count | 1~6 | |
| Final board thickness | 0.05-0.6mm | |
| Aspect Ratio | 3:1 | |
| Copper thickness | 1/3~3oz | |
| Impedance Control |
Single Ended Differential |
+/- 10% +/- 10% |
| Line/Space |
Inner Layer External Layer |
1.6/1.6mil 1.6/1.6mil |
| Min Drill Bit size | 6mil | |
| Hole size tolerance |
PTH NPTH |
+/-2mil +/-1mil |
| Hole Position Tolerance | +/-2mil | |
| Coverlayer |
Line to PAD Registration |
6mil +/-2mil |
| Profile Tolerance |
Puching Laser Cutting |
+/-3mil +/-2mil |
| Surface Finish |
ENIG OSP Immersion Tin Immersion Silver Hard Gold Plating |
Au 1-5u", Ni 80-200u" 0.8-1.2um 0.15-0.45um Au 1-50u", Ni 80-200u" |
3.MPCB capability download
| Base Material | Aluminum(Larid, Ventec,Yugu Boyu), Iron and Copper isolation base | |
| Max dimension | 1200mm* 300mm | |
| Copper foil thickness | 0.5-10OZ | |
| Dielectric thickness | 0.075-0.15mm | |
| Finish Thickness | 0.5-3.2mm（+/-10%） | |
| line width/Gap/td> |
1OZ 2OZ 3OZ 4OZ |
0.15/0.12MM 0.18/0.15MM 0.25/0.2MM 0.3/0.25MM |
| Soldermask opening | 0.05mm | |
| Surface finish | ENIG,OSP,HASL(LF HASL),Immersion Tin,Immersion Silver | |
| Peel strength | ≥ 1.8 N/mm | |
| Surface resistance | ≥ 1*10^5 M | |
| Volume resistrivity | ≥ 1*10^6 M | |
| Solder fioat | 260℃,10Min ,No layerig,No sparkling | |
| Permittivity | ≤ 4.4 | |
| Disspation factor | ≤ 0.03 | |
| Thermal conductivity | 1.0~4.2W/m.k | |
| Hi-pot Withstand | 2~6KV | |
| Surface Finish |
HASL LF HASL ENIG OSP |
SMD 40-2000u", GND 30-800u" SMD 40-2000u", GND 30-800u" Au 1-5u", Ni 80-200u" |
4. Rogers capability download
| Material | Rogers | |
|---|---|---|
| Permitivity | ε2.1-10.0 | |
| Products | RO4350B,RO4450,RO4835,RO3003C,RO3000,RO4000,RO1200 | |
| Layer count | 1~8 | |
| Mixed pressure | Rogers+FR4 , Rogers+AL | |
| Final board thickness | 0.6-6.0mm | |
| Aspect Ratio | PTH | 8:1 |
| Copper thickness | 1~2oz | |
| Impedance Control |
Single Ended Differential |
50+/- 10% 90+/- 10%,100+/- 10% |
| Line/Space |
Inner Layer External Layer |
5/5mil 5/5mil |
| Min Drill size | 11.81mil | |
| Hole size tolerance |
PTH NPTH |
+/-3mil +/-2mil |
| Hole Position Tolerance | +/-2mil | |
| Profile Tolerance | +/-4mil | |
| Soldermask |
Line to PAD Registration |
4mil +/-2mil |
| Warpage | 0.5% | |
| Surface Finish |
ENIG Immersion Tin Immersion Silver |
Au 1-5u", Ni 80-200u" 0.8-1.2um 0.15-0.45um |
| Remarks | Remarks | |
5. Ceramic wafer capability download
| Material | Al 2 O 3 ,AlN | |
| Layer count | Single layer and Double side | |
| Max unit size | 140*190mm | |
| Profile Tolerance | +/-50um | |
| Line/Space | 75/75um | |
| Min drill size | 50um | |
| Copper thickness | 2-210um | |
| Copper filling Aspect Ratio | 5：1 | |
| Copper peel strength | ＞2N/mm(per IPC-TM-650 2.4.8) | |
| Heat Risistance | 350±10℃，15min(per IPC-TM-650 2.4.7) | |
| Solderability | ＞95%(per IPC-TM-650 2.4.14) | |
| Finish |
ENIG OSP ENEPIG Immersion Silver |
Au 1-5u", Ni 80-200u" Ni:2-6um, Au:0.03um min, Pd:0.03um min 0.15-0.45um |
Get Online Quote for PCB Capability Seeing Clearly