One-Stop Ceramic PCB Manufacturer: AlN PCB and Alumina PCB for Power Devices

aluminum nitride pcb manufacturing

Overview of PCBONLINE's Ceramic PCBs

  • Ceramic PCBs are normally aluminum nitride or alumina substrate circuit boards and feature excellent thermal conductivity, heat resistance, and electrical insulation. PCBONLINE manufactures and assembles alumina PCBs, aluminum nitride PCBs, silicon nitride PCBs, IGBT ceramic substrate boards, 3D alumina products used for LEDs, laser equipment, semiconductor, automotive electronics, microwave communications, industrial transducers, etc.
  • Except for BeO PCBs, PCBONLINE provides all types of ceramic PCBs, such as multilayer PCB (HDI), Rogers/FR-4/CEM-3/SST/PTFE/aluminum/copper ceramic hybrid circuit boards. Our target customers for these types of products are senior engineers, solutions companies, research institutes/organizations, business makers. We can help you in your ceramic PCB project by providing free technical support, from choosing ceramic PCB materials, reasonable layout to the end product assembly and testings.

Why Choose Ceramic PCBs

Technical Advantages of Ceramic PCB Manufacturer PCBONLINE

  • ◆ Our ceramic PCBs have better welding performance and more high-temperature resistance.
  • ◆ The thickness of the conductive layer is arbitrarily customized between 1μm to 1mm.
  • ◆ DPC technology can realize three-dimensional circuit design.
  • ◆ The copper layer does not contain an oxide layer and can be used for a long time in aggressive environments.
  • ◆ Our ceramic PCBs have a metal layer with lower resistance and stronger adhesion.
  • ◆ High-density process capability -- the smallest line spacing (L/S) reaches 20μm to realize the small volume, light, and thinness of the products.
ceramic pcb

Your Trusted Alumina/AlN PCB Manufacturer: Explore Our Manufacturing and Capability


Why Buy Ceramic PCBs from PCBONLINE

  • • You can order ceramic PCBs of any substrates, such as Al₂O₃ (alumina), SiC, BeO, AlN (aluminum nitride), Si₃N₄ (silicon nitride), hybrid materials, etc.
  • • We adopt the DPC manufacturing technology, which is more advanced than traditional manufacturing.
  • • Our ceramic PCB factory has decades of manufacturing experience and has leading capabilities.
  • • Our lead-time is short as our ceramic PCB production cycle is greatly reduced.
  • • We always select the best quality ceramic PCB materials with stable chemical properties.
  • • You can enjoy free one-on-one engineering support (DFX) and professional solutions.

Our Processing Technology - Direct Plating Copper (DPC)

We adopt DPC technology, a new ceramic circuit processing technology developed from ceramic thin-film processing, to manufacture ceramic circuit boards. First, we realize the metalization of the ceramic surface. Then we manufacture the conductive copper and functional film layers through the electrochemical method.

Compared with the traditional thick film and thin-film processing technologies, the DPC brings these advantages to our ceramic PCB manufacturing:

  • • faster processing,
  • • no limit to the ceramic type and thickness,
  • • appropriate for micron-rating fine processing.

Our processing flow:

First, we clean the ceramic substrate by pre-treatment. Next, we sputter the ceramic substrate by vacuum coating to bond to the copper composite layer. Then, we use the photoresist coating of yellow light for exposure, development, etching, and film removal to complete the circuit production. And we increase the copper thickness by electroplating/electroless plating. Finally, we remove the photoresist, and the metalized circuit is done.

ceramic PCB processing flow


Ceramic PCB Substrate Technical Specifications

  • To ensure the long service life and high stability of ceramic PCBs, PCBONLINE selects ceramic PCB materials with high-temperature resistance, strong acidic resistance, alkali resistance, high thermal conductivity, and low thermal expansion coefficients. Also, we strictly use 96% alumina substrate and 100% aluminum nitride substrate. Our ceramic PCB substrate specifications are below:
Alumina Substrate Specifications
Characteristics 96% alumina 99% alumina
Color/Appearance White/Dense Beige/Dense
Density 3.6g/cm³ 3.9g/cm³
Hardness 1500HV 1700HV
Warpage ≤0.3mm ≤0.2mm
Parallelism ±0.4% ±0.3%
Substrate Thickness 0.12 to 15mm 0.635 to 20mm
Bending Resistance 3000Kgf/cm² 3500Kgf/cm²
Compressive Strength 25000Kgf/cm² 30000Kgf/cm²
Fracture Toughness 3-4Mpa m1/2 4Mpa m1/2
Thermal Conductivity 25W/(m·K) 31.4W/(m·K)
Voltage Resistance 18KV 18KV
Dielectric Constant [1MHz, 25°C] 9.4 10
Surface Roughness Ra 0.6 to 0.8μm 0.6 to 0.8μm
Water Absorption 0% 0%
Sintering Temperature 1689°C 1700°C
Volume Resistivity / /
Thermal Shock Resistance 200T°C 220T°C
Thermal Expansion Coefficient [20°C to 300°C] 6 to 7.5×10ˆ(-6)°C 8 to 10×10ˆ(-6)°C
Maximum Use Temperature 1400°C 1600°C
Aluminum Nitride Substrate Specifications
Characteristics Values
Color/Appearance Off-white
Thermal Conductivity 170 to 260W/(m·K)
Volume Resistivity >10ˆ13Ω·cm
Dielectric Constant [1MHz, 25°C] 9
Dielectric Loss [1MHz, 25°C] 3.8×10ˆ(-4)
Dielectric strength 17KV/mm
Density ≥3.3g/cm³
Surface Roughness Ra 0.3 to 0.5μm
Thermal Expansion Coefficient [20°C to 300°C] 4.6×10ˆ(-6)°C
Fracture Toughness 320 to 330MPa m1/2
Elastic Modulus 310 to 320GPa
Moh's Hardness 8
Water Absorption 0%
Warpage 0.03 to 0.05mm
Maximum Use Temperature 2500°C

Ceramic Multilayer PCB Lamination Methods by PCBONLINE

multilayer ceramic PCB lamination

PCBONLINE adopts two different lamination methods in multilayer ceramic PCB fabrication. If the PCB requires less thermal conductivity, we adopt the normal lamination method shown in the left image. If the PCB requires high thermal conductivity, we use the sintering lamination method shown on the right.

In the normal lamination process, two ceramic substrate boards are bonded by PP under high temperature and high pressure conditions. The PP materials are mainly phenolic, epoxy resin, special thermal conductive materials, etc. This process's manufacturing cost is low, but it drastically reduces the overall thermal conductivity of the ceramic circuit board, and its bonding strength is not as good as sintering lamination.

In the sintering lamination process, under high temperature and high pressure conditions, molecules of the two ceramic substrate boards' contact surfaces migrate, and the two boards integrate and form dense polycrystalline ceramics as a whole (relative density > 98%). This technology bonds the copper and the base material together with a strong bonding force and high reliability. Meanwhile, the characteristics of the ceramic substrate are not affected, especially the thermal conductivity and flatness.


Ceramic PCB Applications

You can use ceramic PCBs for high-power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronics, high-power LED lighting products, communication antennas, automotive sensors, refrigeration sheets, etc.

Our Ceramic PCB Services for You


One-Stop PCB Manufacturing


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