Why Buy Ceramic PCBs from PCBONLINE
Our Processing Technology - Direct Plating Copper (DPC)
We adopt DPC technology, a new ceramic circuit processing technology developed from ceramic thin-film processing, to manufacture ceramic circuit boards. First, we realize the metalization of the ceramic surface. Then we manufacture the conductive copper and functional film layers through the electrochemical method.
Compared with the traditional thick film and thin-film processing technologies, the DPC brings these advantages to our ceramic PCB manufacturing:
Our processing flow：
First, we clean the ceramic substrate by pre-treatment. Next, we sputter the ceramic substrate by vacuum coating to bond to the copper composite layer. Then, we use the photoresist coating of yellow light for exposure, development, etching, and film removal to complete the circuit production. And we increase the copper thickness by electroplating/electroless plating. Finally, we remove the photoresist, and the metalized circuit is done.
Ceramic PCB Substrate Technical Specifications
|Alumina Substrate Specifications|
|Characteristics||96% alumina||99% alumina|
|Substrate Thickness||0.12 to 15mm||0.635 to 20mm|
|Fracture Toughness||3-4Mpa m1/2||4Mpa m1/2|
|Dielectric Constant [1MHz, 25°C]||9.4||10|
|Surface Roughness Ra||0.6 to 0.8μm||0.6 to 0.8μm|
|Thermal Shock Resistance||200T°C||220T°C|
|Thermal Expansion Coefficient [20°C to 300°C]||6 to 7.5×10ˆ(-6)°C||8 to 10×10ˆ(-6)°C|
|Maximum Use Temperature||1400°C||1600°C|
|Aluminum Nitride Substrate Specifications|
|Thermal Conductivity||170 to 260W/(m·K)|
|Dielectric Constant [1MHz, 25°C]||9|
|Dielectric Loss [1MHz, 25°C]||3.8×10ˆ(-4)|
|Surface Roughness Ra||0.3 to 0.5μm|
|Thermal Expansion Coefficient [20°C to 300°C]||4.6×10ˆ(-6)°C|
|Fracture Toughness||320 to 330MPa m1/2|
|Elastic Modulus||310 to 320GPa|
|Warpage||0.03 to 0.05mm|
|Maximum Use Temperature||2500°C|
Ceramic Multilayer PCB Lamination Methods by PCBONLINE
PCBONLINE adopts two different lamination methods in multilayer ceramic PCB fabrication. If the PCB requires less thermal conductivity, we adopt the normal lamination method shown in the left image. If the PCB requires high thermal conductivity, we use the sintering lamination method shown on the right.
In the normal lamination process, two ceramic substrate boards are bonded by PP under high temperature and high pressure conditions. The PP materials are mainly phenolic, epoxy resin, special thermal conductive materials, etc. This process's manufacturing cost is low, but it drastically reduces the overall thermal conductivity of the ceramic circuit board, and its bonding strength is not as good as sintering lamination.
In the sintering lamination process, under high temperature and high pressure conditions, molecules of the two ceramic substrate boards' contact surfaces migrate, and the two boards integrate and form dense polycrystalline ceramics as a whole (relative density > 98%). This technology bonds the copper and the base material together with a strong bonding force and high reliability. Meanwhile, the characteristics of the ceramic substrate are not affected, especially the thermal conductivity and flatness.
Ceramic PCB Applications
You can use ceramic PCBs for high-power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronics, high-power LED lighting products, communication antennas, automotive sensors, refrigeration sheets, etc.
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