Process of SMT
SMT Stencil Types
There are four types of SMT stencils. The most widely used types are the framed and framless SMT stencils, which are the main stencils produced by PCBONLINE. But still, you can get other types of SMT stencils from us.
1.Framed SMT Stencils
Framed PCB stencil is a laser cutting stencil process mounted permanently in the stencil frame with the help of mesh border to stretch the stencil foil tightly in the frame. Framed stencils come into design consideration for high volume screen printing.
Smooth aperture walls of framed SMT stencil are usable for less and equal to 16 Mil fine pitch as well as Micro BGS's. The permanent circuit board mounting offers maximum integrity levels and gives non-fading fiducial results.
2.Frameless SMT Stencils
Frameless PCB stencil, on the other hand, works with the stencil tensioning systems called reusable stencil frames. It also comes in a laser cutting stencil process category. This SMT stencil design is not glued permanently in the frame. They cost very less as compare to framed stencil and saves money by well maintain superior performance and quality.
The storage space is saved due to compact size. High engineering quality promotes maximum performance throughout the frameless PCB stencil life.
3.Prototype SMT Stencil
These are customized stencils designed in the CAD or Gerber to match the prototype PCB. They are solder paste frameless stencils explicitly created for printing manually.
Prototype SMT stencils remove the tiresome error-prone process of soldering the prototype circuit boards with hands.
The maximum efficiency and quick alignment reduce the assembly time of the prototype. It is cost-effective, requires no machine use, and is an easy-to-understandable circuit board printing process.
4.Electroformed SMT Stencils
This PCB stencil is nickel-based, made of electroforming foil mounted permanently in the stencil frame by using the mesh border to stretch the foil taut tightly. They have the best paste releasing characteristics. They are used commonly for excellent pitch SMT applications, Wafer Bumping (12-6 mil pitch), Flip Chip, and µBGAs.
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