Materials for Manufacturing
No matter how complex your high-Tg PCB needs to be, we can meet your requirements! The following information below lists our production capabilities.
1. Inner layer technology
We use high-TG, high speed, high frequency, thick copper, thin dielectrics, and other special materials for our high-layer count boards.
When boards have these high requirements for inner layer production then controlling the integrity of signal transmissions greatly increases in difficulty. As a trace width decreases a design is more likely to experience open and short circuits during manufacturing. These situations cause the yield of any design to decrease which is not ideal. On top of this, as the number of signal layers and fine traces increase, the probability of AOI missing issues on the inner layer increases. The thickness of the inner-layer dielectrics can be relatively thin and easy to fold which causes poor exposure when being etched. Most of the high-layer count PCBs are large in size and the cost associated with scrapping a finished product is rather high. Thankfully, all of these issues can be solved. PCBONLINE carries out the technical transformation of high-end equipment and imported high-precision etching line tools to improve the uniformity of etching, reducing problems such as rough edges and unclean etching, so as to improve the final quality of the design.
2. Laminating technology
Multiple inner layer dielectrics use semi-solidified sheets that are superimposed. Defects such as slide plate, lamination, resin cavities, and bubble residue are easily generated during the laminating process. In the design of the laminated structure, the heat resistance, voltage resistance, amount of glue and thickness of the medium should be fully considered, and a high quality software that controls the laminating process should be used. When using a lot of layers, it is hard to control the expansion and shrinkage coefficients which makes it difficult to maintain consistency. Also, thin dielectric materials can easily lead to the failure of reliability tests between two nearby layers. PCBONLINE has adopted materials with different Tg values during lamination pressing, which cannot be met with at the same time. For example, simple boards cannot be laminated at the same time as boards requiring special parameters. Controlling this process ensure that expansion and contraction coefficient are being observed carefully and that the performance of the different boards are being controlled.
3. Drilling technology
PCBONLINE also adopts special boards with high-Tg, high speed, high frequency, and thick copper, which increases the difficulty of controlling drilling roughness, burrs, and de-fouling. Multiple layers accumulated with the total copper thickness and board thickness can cause drilling to be extremely difficult. It is very easy to break a drill bit when drilling a hole in thick PCBs that have a high amount of coper. In this regard, PCBONLINE uses the appropriate reduction of insertion speed and rotation speeds for each drill location as well as accurately measures the expansion and contraction of the board to provide accurate coefficients to the manufacturing and drilling process.
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