HDI PCB - Higher Circuit Density, Higher Speed Signal

hdi pcb

Overview of HDI PCBs

  • HDI PCBs are high-density interconnect circuit boards that utilize extremely small traces and vias to decrease the overall size of an electrical design.
  • HDI PCBs are also perfect for designs where electrical performance and noise rejection are of upmost importance. If you need to design a PCB with a high layer count and micro vias, then an HDI technology is the best solution for your needs.
  • PCBONLINE provides our customers with the highest quality HDI manufacturing services that can be found.

Advantages of HDI PCBs


  • • We have a skilled team that is knowledgeable in high-precision via back drilling, quality PCBA processes, and overall highly complicated HDI PCBs.
  • • We ensure that your product's signal transmission integrity is met by using top-of-the-line technologies to reduce signal series inductance of through holes.
  • • We utilize a specialized surface treatment process for all of our HDI production lines.
  • • We have state of the art German machines for V-cuts, tabs, and stack-up management as well as Mitsubishi machines for laser drilling, Hitachi mechanical drilling machines, and processes for automatic LDI and AOI.
  • • We also utilize the best temperature cycling equipment to ensure that your boards are high reliability and stable over time.
  • • We strictly follow all current IPC standards and provide you with your completed boards on time.
Hdi pcb 2

HDI PCB - Manufacturing and Tech Specs


Lamination Processes in HDI PCBs

  • HDI PCBs have conductive pathways that connect components in a high density package with the use of laser micro vias and high quality thin substrates. Generally, we distinguish HDI boards by the number of lamination cycles and laser drill pairs that are required. For example, 1+N+1, 1+1+N+1+, and 2-(N-1) are all constructions of HDI boards. Our general lamination process for a multi-layer HDI is described below:
  • Firstly, we bond layers together via standard lamination process by subjecting two layers and a substrate material to high temperatures and pressure. The circuit traces on each of the layers of copper are etched away using a photosensitive dry resist and fine imaging technologies. If a PCB has multiple subsets within the same design, then we use a sequential lamination process where a dry, electronic substance is placed between each pair of subsets. After this process, standard manufacturing processes can be implemented.
  • The most common lamination type for HDI laminates are PTFE and FR4 mix laminates. PTFE has a consistent and controlled dielectric constant, very low substrate imperfections, and a tight tolerance for the overall thickness. For HDI PCBs, PTFE is the most common material selection.
  • If you have a specific electrical performance requirement for your application, then we can help you to choose the best lamination and substrate type. If you need any advice about your specific HDI PCB lamination process, then you can contact us via email at info@pcbonline.com.

HDI PCBs with Stacked Vias

Often times HDI designs require that vias are stacked on top of one another to transfer signals between layers. There are times when these vias are staggered from one another, but it is also possible that the vias are not staggered at all. We can utilize this stacked via technology to route fine pitch components with very small diameter blind and buried vias. Micro vias typically require the use of a sequential lamination process because of the small drill diameters and via aspect ratio requirements of those drills.

  • hdi pcb stacked via hole

How to Choose HDI PCB Materials

  • Choose the correct materials for your specific application is one of the most important processes of designing a high-quality HDI PCB. On top of requiring fine pitch pads, thin traces, and laser drilled micro vias, you will also need to consider the signal integrity of your design for any high-speed signals. If you require complicated thickness structures, large mechanical drills, multiple inner layers with sequential laminations, and micro vias, then you will need to choose the appropriate materials for your design. You can use any of the brands shown below or you can ask our engineers to help you.
  • hdi pcb stacked via hole

Technical Specifications

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