HDI PCB Manufacturing Capabilities

Applications of HDI PCBs
- ● Battery switches
- ● Power distributors
- ● Motor controls
- ● LED applications control
- ● Automotive, industrial, communications electronics
- ● Satellites, microsystems
Specifications
PCBONLINE's HDI PCB Capabilities
PCB layers
4 to 64 layers
High-density layers
Up to 20 layers
Build time
1 day to 4 weeks
Stackup
1+N+1, 2+N+2, 3+N+3, 4+N+4
HDI via
Blind via, buried via, staggered via, stacked via, skip via
Minimum laser drill diameter
0.075mm
Final PCB thickness
0.15mm
Minimum trace width/space
Flex/rigid-flex PCBs: 1.6mil/1.6mil
Rigid PCBs: 2.5mil/2.5mil
Minimum mechanical drill diameter
1+N+1, 2+N+2, 3+N+3, 4+N+4 (with copper filling)
HDI PCB production capability
3000m² per day
Copper thickness
100μm to 125μm