One-Stop HDI PCB Manufacturing of Stackups from 1+N+1 to 4+N+4

"PCBONLINE has 3000m² of HDI PCB manufacturing capability per day. We are dedicated to providing end-to-end HDI PCB solutions, from the initial idea to high-volume production."
HDI PCB manufacturer PCBONLINE

HDI PCB Manufacturing Capabilities

HDI PCB structure

Applications of HDI PCBs

  • ● Battery switches
  • ● Power distributors
  • ● Motor controls
  • ● LED applications control
  • ● Automotive, industrial, communications electronics
  • ● Satellites, microsystems
PCBONLINE's HDI PCB Capabilities

PCB layers

4 to 64 layers

High-density layers

Up to 20 layers

Build time

1 day to 4 weeks


1+N+1, 2+N+2, 3+N+3, 4+N+4

HDI via

Blind via, buried via, staggered via, stacked via, skip via

Minimum laser drill diameter


Final PCB thickness


Minimum trace width/space

Flex/rigid-flex PCBs: 1.6mil/1.6mil
Rigid PCBs: 2.5mil/2.5mil

Minimum mechanical drill diameter

1+N+1, 2+N+2, 3+N+3, 4+N+4 (with copper filling)

HDI PCB production capability

3000m² per day

Copper thickness

100μm to 125μm


>95% (IPC-TM-650 2.4.14)

Advantages of the One-Stop HDI PCB Manufacturer PCBONLINE

One-stop PCB manufacturing for HDI builds 1+N+1, 2+N+2, 3+N+3, 4+N+4
Able to manufacture HDI layers in any layer in R&D
Offer an extensive range of technologies and solutions that meet your requirements
Varying copper thickness in PCB manufacturing is available from PCBONLINE
1000 employees, 4 manufacturing bases, 3000m² of HDI PCB production capacity per day
PCBONLINE's precise and controllable mechanical deep drilling empowers HDI technological possibilities

HDI PCB Certifications

HDI Certifications

HDI PCB and Microvia

  • HDI PCBs, or microvia PCBs, are high-density-interconnect printed circuit boards with blind microvias, fine traces, and sequential lamination structures. HDI PCBs usually have a horizontally symmetrical structure. Besides blind vias, HDI PCBs often have buried microvias. Generally, we distinguish HDI PCBs by the number of lamination cycles and laser drill pairs that are required. For example, 3+N+3 means the HDI PCB requires three times laser drilling and laminations.
  • Microvias can only be laser drilled and has an aperture of 6mil and below. In HDI PCBs, microvias can be single, staggered, stacked, and skipped. The smaller microvia aperture, the smaller parasitic capacitance, and it is more practical for high-speed circuits.

HDI PCB Lamination

HDI PCB manufacturing process
A microvia penetrates only one PCB layer, and the number of microvia pairs stands for how many times of lamination in HDI PCB manufacturing.
The internal layers without microvias are laminated in the standard lamination way under high temperatures and high pressure. Prepreg melts, fills in gaps between adjacent copper layers, and cures so that the copper layers are bonded and insulated.
Lamination to external layers with microvias is more difficult than internal layers. Microvias are laser dilled before lamination, and after lamination, microvias on different layers may overlap to form stacked vias or stagger to form staggered vias. Positioning for laser drilling and lamination should be highly accurate. Otherwise, the board defects. So HDI PCB manufacturing costs more than normal PCBs.

Advantages of HDI PCBs

  • HDI PCBs are suitable for products where electrical performance and noise rejection are of utmost importance. The advantages of HDI PCBs include:
  • ● HDI technology decreases products' overall size and improves electrical performance.
  • ● HDI PCBs have great impedance control and impressive high-frequency transmission capabilities.
  • ● HDI PCBs offer a perfect solution for fine pitch packages, flip-chip assemblies, and complicated BGA designs.

We are solution experts to HDI PCB projects
Contact our team here

HDI PCB supplier

HDI PCB Examples

"Our supplier PCBONLINE manufactures HDI PCBs meeting all our requirements even though our boards are very high demands. For example, our HDI PCBs require selective surface finishes of immersion gold 2μ" and OSP, half holes, minimum trace space of 2.5mil/2.5mil, and interconnection between inner layers. "

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