Lamination Processes in HDI PCBs
HDI PCBs with Stacked Vias
Often times HDI designs require that vias are stacked on top of one another to transfer signals between layers. There are times when these vias are staggered from one another, but it is also possible that the vias are not staggered at all. We can utilize this stacked via technology to route fine pitch components with very small diameter blind and buried vias. Micro vias typically require the use of a sequential lamination process because of the small drill diameters and via aspect ratio requirements of those drills.
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