Environment Friendly Lead-Free PCB Compliant with RoHS Standard

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Overview of Lead-Free PCB

  • Are you looking for lead-free PCB manufacturing and assembly made in PCBONLINE? Lead-free PCB means the circuit board contains no lead and is environmentally friendly, and it can be shipped to Europe and around the globe. It has great thermal properties and is more durable than the traditional PCB.
  • From PCB manufacturing, assembly, components, to final product assembly, the whole production can be lead-free if you order from PCBONLINE.

Advantages of Lead-Free PCB

Why Choose Lead-Free PCB from PCBONLINE

  • • Lead-free PCB manufacturing and assembly are fully implemented.
  • • PCBONLINE ensures that the solder joints are of high quality and meet IPC-610D standards.
  • • Quality assured - PCBONLINE uses AOI, X-ray, and other automatic equipment to check for soldering defects.
  • • We implement lead free surface finishes on both bare boards and assembled printed circuit boards.
  • • Our lead-free solder is more active than the traditional solder.
  • • Parts meet the requirements for lead free compliance of reliability and durability when the product is finalized.
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Lead-Free PCB - Manufacturing and Tech Specs

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Lead-Free PCB Materials and Process

  • Selection of lead-free base materials
  • Choosing the correct base material for lead-free PCB is critical as the solder joint of HASL lead-free is 34°C higher than that of with lead. One should consider the heat resistance, CAF resistance, and machinability while choosing.
  • It is most important to use the base material with high thermal decomposition temperature resin as the heat resistance of CCL mainly depends on it, and only by increasing the thermal decomposition temperature of resin in CCL can the thermal reliability of lead-free soldering PCB be guaranteed. In addition, IPC-4101c stipulates that the Td value of lead-free base material should be greater than or equal to 325°C.
  • To choose the correct base materials, PCBONLINE engineers carry out experiments and find that only use only using base material with high Tg and Z-CTE is not enough, which increases the cost and can't improve the heat resistance either. Under the same Tg and Z-CTE conditions, after the T260 test, the delamination time of the base material with Td at 350°C lags behind the base material with Td at 320°C by 10s. Therefore, we suggest that it is better to choose the lead-free base material with Td value greater than 350°C in actual production.
  • Lead-free base material have different machinability with lead base material. The following is the commonly used material comparison table used in PCBONLINE.
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Manufacturing Process

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Lead Free PCB Assembly

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What is the RoHS

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